. This unit is suitable for de-soldering operations on various surface-mount components and through-hole components, such as SOP, DIP, SOIC, etc.
Specifications:
- Main Unit Dimensions: L142xW94xH50mm ±5mm
- Operating Ambient Temperature: 0 ~ 40°C/ 32°F ~ 104°F
- Temperature Range: 90°C ~ 450°C/ 194°F ~ 842°F
- Display: LED Nixie Tube
- Tip to Ground Resistance: <2 Ohms
