This YIHUA 995D+ I is suitable for desoldering and soldering operations on a broad range of components, e.g. SOIC, CHIP ,QFP, PLCC, BGA, SMD, and more. The unit is especially suited for desoldering operations on in-line sockets.
The unit can be used for heat shrinking, drying, paint removal, conform coating removal, defrosting, pre-heating, glue soldering and more.
Main Unit Dimensions: L148*W99*H134 ±5mm
Operating ambient temperature: 0~40°C/32°F~104°F
HOT AIR REWORK STATION
Air delivery: Brushless blower with smooth air delivery
Air volume: ?120L/min
Temperature range: 100~480°C/212°F~896°F
Temperature range: 200~480°C/392°F~896°F
Soldering tip to ground resistance: <2 ohms